Manufacturing Facility

This industrial concrete construction project involved building a semiconductor manufacturing facility featuring 25-foot-tall cast-in-place (CIP) perimeter walls installed over a 6-inch void form system. Construction occurred during winter conditions, requiring careful planning for formwork, reinforcing steel placement, and concrete pours. 

The project included a 20- to 26-inch-thick slab-on-grade, placed over the void form using multiple concrete pumps to manage high-volume placements. Due to site constraints, concrete was pumped through openings in precast walls and roof systems, sometimes requiring additional pump setups to reach interior placements. 

Maintaining schedule was critical, as concrete placement needed to be completed before weather conditions impacted the integrity of the void form. Through detailed sequencing and strong coordination with project partners, the team ensured efficient execution and enabled follow-on trades to mobilize without delay. 

This project supports the creation of approximately 600 new jobs and advances U.S.-based semiconductor manufacturing, strengthening domestic production capabilities.